Copper clad laminates (CCLs) play a crucial role in the manufacturing of printed circuit boards (PCBs), which serve as the foundation for various electronic devices. These laminates are composed of a layer of copper foil bonded to a substrate material, such as epoxy resin or paper, offering excellent electrical conductivity and mechanical strength. The global copper clad laminates market has experienced substantial growth in recent years, driven by the increasing demand for advanced electronic devices and the ongoing digital revolution. This article provides an overview of the market trends, growth drivers, and key players in the copper clad laminates industry.

The Copper clad laminates market size is estimated to be USD 16.4 billion in 2022 and is projected to reach USD 21.6 billion by 2027, at a CAGR of 5.7%. Copper clad laminate or CCL is a type of PCB material made using reinforcement materials like glass fibre, paper, or other materials, impregnated with resin adhesive like epoxy, phenolic etc and covered with copper foil on either side or one side. Copper clad laminates are used by printed circuit board fabricators to create a variety of boards, notably single-layer, double-layer, and multi-layered boards. Radios, computers, televisions, mobile devices, and many more electronic assemblies all use copper clad laminates.

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Expanding Electronics Industry:

The proliferation of electronic devices, ranging from smartphones and tablets to automotive electronics and industrial equipment, has fueled the demand for copper clad laminates. The growing consumer electronics industry, coupled with the rising trend of miniaturization and integration of components, has led to the need for high-performance PCBs. Copper clad laminates enable the efficient transmission of electric signals while offering excellent thermal stability, making them an ideal choice for modern electronic applications.

Advancements in Communication Technologies: The rapid advancements in communication technologies, including 5G networks and the Internet of Things (IoT), have further propelled the demand for copper clad laminates. These laminates provide the necessary support for high-frequency applications, ensuring signal integrity and minimizing interference. As the world becomes increasingly interconnected, there is a growing need for reliable and high-speed communication networks, which directly translates to an increased demand for advanced copper clad laminates.

Emerging Trends in Automotive Electronics:

The automotive industry is undergoing a transformation with the introduction of electric vehicles (EVs) and autonomous driving technologies. These developments have significantly increased the complexity of automotive electronics systems, requiring advanced PCBs capable of handling higher power densities and offering enhanced thermal management. Copper clad laminates with superior thermal conductivity and insulation properties are crucial for ensuring the performance and safety of electronic components in EVs and autonomous vehicles.

Copper Clad Laminates Market Key Players

The demand for copper clad laminates is mainly furnished by global players manufacturing for various end-use industries. Some of the leading companies involved in the manufacturing of copper clad laminates are Kingboard Laminates Holdings Ltd. (China), Shengyi Technology Co., Ltd (China), Nan Ya Plastics Corporation (Taiwan), Panasonic Holdings Corporation (Japan), Taiwan Union Technology Corporation (Taiwan) and others are covered in the Copper clad laminates market. These companies, along with other regional companies, cater to the demand for copper clad laminates globally.

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Kingboard Laminates Holdings Ltd. (China) manufactures copper clad laminates and produces component materials such as copper foil, glass yarn, glass fabric, bleached kraft paper, epoxy resin, and glass fabric. The group also manufactures laminate goods, such as glass epoxy and flame-resistant paper laminates. The group runs more than 20 factories in southern and eastern China. The company also produces and sells chemicals, glass fabric, bleached kraft paper, and other products through its subsidiaries.

Shengyi Technology Co., Ltd (China), is a manufacturer of electronic circuit base materials. The company produces high-end electronic materials such as CCL, prepreg, insulation boards, metal-based CCL, resin-coated copper (RCC). Products are mostly used to create multi-layer boards and PCBs with single and double sides. The company has headquarters in China.

By resin type, epoxy accounted for the largest market share

The Copper clad laminates market has been segmented based on the resins used in the copper clad laminates i.e., epoxy, phenolic, polyimide and others. Epoxy is the most common resin used in copper clad laminates. Due to a wide application base like home appliances, IT peripherals, consumer electronics, and electronic communication systems, it dominates the market. Paper-phenolic copper clad laminates are cost effective. It is used in IT peripherals, communication systems and consumer electronics.

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Copper Clad Laminates Market Segments

Copper Clad Laminate Market, By Type

• Rigid copper clad laminates
• Flexible copper clad laminates

Copper Clad Laminate Market, By Reinforcement Material

• Glass Fiber 
• Paper Base 
• Compound Materials 

Copper Clad Laminate Market, By Resin Type

• Epoxy
• Phenolic
• Polyimide
• Others

Copper Clad Laminate Market, By Application

• Computers 
• Communication Systems
• Consumer Appliances 
• Vehicle Electronics 
• Healthcare Devices 
• Defense Technology

By Application, communication systems accounted for the largest share in 2021

Copper clad laminates can be used in a variety of applications like computers, communication systems, consumer appliances, vehicle electronics, healthcare devices and defense technology. According to projections, the communication systems will be the biggest market for copper clad laminates. The market for 5G infrastructure is expanding as a result of rising acceptance of virtual networking in the telecom industry, lower latency in 5G, and an increase in mobile traffic data. High consumer demand and industrial automation generates increased demands for effective communication systems which drives the market for copper clad laminates. 

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Copper Clad Laminate Market, By Region

• Asia Pacific (APAC)
• North America
• Europe
• Rest Of the World 

APAC is projected to account for the largest share of copper clad laminates in 2021

The largest market for copper clad laminates is anticipated to be in APAC over the projected period. China, Taiwan, South Korea and Japan are the main contributors in the same. The growth is led by rapid increasing demand for copper clad laminates from various industries, including computers, communication systems, consumer appliances, vehicle electronics, healthcare devices etc. The investments in 5G infrastructure and technological shift in automobile sector to electric vehicles is a major reason for growth of copper clad laminate market.

Recent Developments

• In October 2022, Taiwan Union Technology Corporation (TUC) launched RF/mmWave products- PegaClad series to meet the needs of 5G applications. These can be applied to low-orbit satellites and mmWave automotive radars
• In March 2022, Taiwan Union Technology Corporation (TUC) collaborated with IEC to provide the best quality to the PCB sector.
• In October 2021, TUC launched new advanced materials for high-speed and high-frequency applications to meet the needs of 5G.
• In October 2021, TUC launched PegaClad series materials for sub6GHz/mmWave antenna/radar applications.
• In January 2022, Panasonic corporation's industry company has developed the MEGTRON 8 multi-layer circuit board materials featuring low transmission loss specifically for high-speed networking devices.
• In February, Panasonic Corporation revealed that its Industrial solutions company began selling R-5410, a halogen-free multi-layer circuit board material with extremely low transmission loss appropriate for millimeter-wave antennas. March 2021 marked the beginning of mass production. This will help achieve enhanced Mobile BroadBand (eMBB), massive Machine Type Communications (mMTC), and Ultra-Reliable and Low Latency Communications (https://www.marketsandmarkets.com/Market-Reports/copper-clad-laminates-market-100748480.htmlLC) in 5G (5th generation mobile communication systems).
• March 2022, ITEQ Corporation created a joint venture firm in Taiwan with the Japanese electronic and chemical materials manufacturer, Mitsubishi Gas Chemical Company, Inc. with the aim of producing and marketing products for laminated material for printed wiring boards.
• In February 2021, AGC Inc., and NTT DOCOMO and a global group entered into a fundamental agreement to form a consortium to offer 5G technologies, initially in Thailand and then potentially in other Asia Pacific nations with the addition of new partners. ACTIVIO Inc., AGC Inc., Advanced Wireless Network Co., Ltd., etc. AGC Inc. is expected to be involved in the provision of innovative proprietary thin, small-footprint, antenna components and the enhancement of indoor coverage technologies, primarily for mm-Wave.
• In 2022, AGC Ceramics created a joint venture in China for the BRIGHTORBTM 3D printer business.
• In October 2022, Rogers Corporation announced a second multi-million Euro investment in its site in Eschenbach, Germany. By making this extra investment, Rogers will be able to meet the rising demand in the automotive, renewable energy, and industrial industry segments and expand the capacity of curamik AMB (Active Metal Brazed) and DBC (Direct Bonded Copper) substrates. The expansion's first phase was expected to be finished in the second half of 2022, while subsequent phases are expected to start in 2023.
• In July 2022, Rogers Corporation through the POWERDRIVE project: power electronics optimization for next-generation electric car components, the company announced its participation in the European Union's Horizon Europe research initiative. The integrated busbar solution from Rogers, called ROLINX Power Interconnect, will be available. It offers outstanding performance in power distribution with a wide variety of laminated and powder-coated busbars. The ROLINX team will collaborate with important stakeholders to speed system-level optimization by leveraging its design expertise and process engineering capacity.